■ ■ PVD工艺
  真空镀膜是在真空中将钛、金、石墨、水晶等金属或非金属、气体等材料利用溅射、蒸发或离子镀等技术, 在基材上形成薄膜的一种表面处理过程。与传统化学镀膜方法相比,真空镀膜有很多优点:如对环境无污 染,是绿色环保工艺;对操作者无伤害;膜层牢固、致密性好、抗腐蚀性强,膜厚均匀。 
  真空镀膜技术中经常使用的方法主要有:蒸发镀膜(包括电弧蒸发、电子枪蒸发、电阻丝蒸发等技术)、溅射镀膜(包 括直流磁控溅射、中频磁控溅射、射频溅射等技术),这些方法统称物理气相沉积(Physical Vapor Deposition), 简称为PVD。与之对应的化学气相沉积(Chemical Vapor Deposition)简称为CVD技术。行业内通常所说的“IP”(ion plating)离子镀膜,是因为在PVD技术中各种气体离子和金属离子参与成膜过程并起到重要作用,为了强调离子的作 用,而统称为离子镀膜。



  Vacuum plating is a surface treatment process that sputtering, evaporation or ion-plating are used to make metals (such as titanium or gold) or non-metallic materials (graphite or crystal) deposit a coating on a metal substrate. Vacuum plating has more advantages compared with traditional chemical plating. It is environmentally friendly, non polluting, and not hazardous to operators. Vacuum plated coatings are stable, dense, uniform, and corrosion resistant.
  There are two vacuum plating methods. One is CVD (Chemical Vapor Deposition). The other is PVD (Physical Vapor Deposition). PVD includes evaporation plating (arc, electronic gun and resistance wire) and sputtering plating (DC magnetron Mid-frequency and RF). Gas ions and metal ions play an important role in coating formation. In order to emphasize the ion function, PVD is generally referred to as IP (Ion Plating).



Tritree is one of the leaders in the IP industry.